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*Absorption Light (see [[Light Absorption]])
*Absorption Light (see [[Light Absorption]])
*[[Absorption Sound Waves]]
*[[Absorption Sound Waves]]
*[[Accuracy Class]]
*[[Acoustic Emission]]
*[[Acoustic Emission]]
*Acoustic Microscopy (see [[Scanning Acoustic Microscopy (SAM)]])
*Acoustic Microscopy (see [[Scanning Acoustic Microscopy (SAM)]])
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*[[Ball Indentation Hardness]]
*[[Ball Indentation Hardness]]
*Ball Indentation Hardness IRHD (see [[IRHD Hardness]])
*Ball Indentation Hardness IRHD (see [[IRHD Hardness]])
*[[Ball or Pin Impression Method]]
*[[Ball or Pin-Impression Method]]
*BARENBLATT Crack Model (see [[Crack Model according to BARENBLATT]])
*BARENBLATT Crack Model (see [[Crack Model according to BARENBLATT]])
*[[Barrier Plastics]]
*[[Barrier Plastics]]
Line 52: Line 53:
* Bending Stiffness (see [[Stiffness]] and [[Bend Test Compliance]])
* Bending Stiffness (see [[Stiffness]] and [[Bend Test Compliance]])
*[[Bend Loading]]
*[[Bend Loading]]
*[[Bend Strip Method]]
*[[Bend Test]]
*[[Bend Test]]
*[[Bend Test and Light Microscopy]]
*[[Bend Test and Light Microscopy]]
Line 63: Line 63:
*[[Bend Test – Test Influences]]
*[[Bend Test – Test Influences]]
*[[Bend Test – Yield Stress]]
*[[Bend Test – Yield Stress]]
*[[Bent Strip Method]]
*[[Bierögel, Christian]]
*[[Bierögel, Christian]]
*[[Bio-Plastics]]
*[[Bio-Plastics]]
Line 90: Line 91:
*Clamping Jaws (see [[Specimen Clamping]])
*Clamping Jaws (see [[Specimen Clamping]])
*Clip-on Strain Gauge (see [[Tensile Test#Tensile test, path measurement technique|Tensile Test, Path Measurement Technique]])
*Clip-on Strain Gauge (see [[Tensile Test#Tensile test, path measurement technique|Tensile Test, Path Measurement Technique]])
*[[CLS-Specimen]]
*Cohesive Strength (see [[Fracture]])
*Cohesive Strength (see [[Fracture]])
*Cold Stretching (see [[Tensile Test]])
*Cold Stretching (see [[Tensile Test]])
Line 158: Line 160:
*[[C-Scan Technique]]
*[[C-Scan Technique]]
*[[CT-Specimen]]
*[[CT-Specimen]]
*[[CTS-Specimen]]
*[[Curing]]
*[[Curing]]
}}
}}
Line 166: Line 169:
*Damage Analysis of Plastic Products (see [[Failure Analysis Plastics Products, VDI Guideline 3822]])
*Damage Analysis of Plastic Products (see [[Failure Analysis Plastics Products, VDI Guideline 3822]])
*[[DCB-Specimen]] (Double-Cantilever Beam)
*[[DCB-Specimen]] (Double-Cantilever Beam)
*De BROGLIE equation (see [[Resolution Microscope]])
*Defect Density (see [[Tensile Test Event-related Interpretation]])
*Defect Density (see [[Tensile Test Event-related Interpretation]])
*[[Deformation]]
*[[Deformation]]
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*[[Fatigue Strength]]
*[[Fatigue Strength]]
*[[Fatigue Crack Propagation Elastomers]]
*[[Fatigue Crack Propagation Elastomers]]
*Fibre Formation (see [[Fracture Types]], [[Craze Types]] and [[Fracture Parables]])
*[[Fibre–Matrix Adhesion]]
*[[Fibre–Matrix Adhesion]]
*[[Fibre-reinforced Plastics]]
*[[Fibre-reinforced Plastics]]
Line 269: Line 274:
*[[Fracture Types]]
*[[Fracture Types]]
*[[Free Falling Dart Method]]
*[[Free Falling Dart Method]]
*[[Freeze-Time]]
*[[Freezing-Time]]
*[[Frequency Analysis]]
*[[Frequency Analysis]]
*[[Frequency Response Control]]
*[[Frequency Response Control]]
Line 413: Line 418:
*[[Laser Parallel-Scanner]]
*[[Laser Parallel-Scanner]]
*[[Layer Silicate-reinforced Polymers]]
*[[Layer Silicate-reinforced Polymers]]
*[[Laser Sintering Process]]
*[[Laser TMA-Scanner]]
*[[Laser TMA-Scanner]]
*[[Levels of Knowledge in Fracture Mechanics]]
*[[Levels of Knowledge in Fracture Mechanics]]
*[[Light Absorption]]
*[[Light Absorption]]
*[[Light Remission]]
*[[Light Transmission]]
*Linear-elastic Fracture Mechanics (LEFM) (see [[Fracture Mechanics]])
*Linear-elastic Fracture Mechanics (LEFM) (see [[Fracture Mechanics]])
*[[Linear-viscoelastic Behaviour]]
*[[Linear-viscoelastic Behaviour]]
Line 428: Line 436:
*[[Machine Compliance]]
*[[Machine Compliance]]
*[[Macrodispersion Degree Elastomers]]
*[[Macrodispersion Degree Elastomers]]
*[[Magnification Microscope]]
*[[Manufacturer of Material Testing Machines]]
*[[Manufacturer of Material Testing Machines]]
*[[Martens, Adolf]]
*[[Martens, Adolf]]
Line 457: Line 466:
*Microcrack (see [[Crack]])
*Microcrack (see [[Crack]])
*[[Micro-Damage Limit]]
*[[Micro-Damage Limit]]
*Mcrohardness (see [[Hardness]])
*Microhardness (see [[Hardness]])
*Micro-IRHD (see [[IRHD Hardness]])
*Micro-IRHD (see [[IRHD Hardness]])
*[[Micromechanics & Nanomechanics]]
*[[Micromechanics & Nanomechanics]]
Line 503: Line 512:
== O ==
== O ==
{{Mehrspaltige Liste |breite=30em |liste=
{{Mehrspaltige Liste |breite=30em |liste=
*[[Object Raster Method]]
*Orientation (see [[Tensile Test Residual Stresses Orientations]])
*Orientation (see [[Tensile Test Residual Stresses Orientations]])
*Overview about J-Integral Evaluation Methods (see [[J-Integral Evaluation Methods (Overview)]])
*Overview about J-Integral Evaluation Methods (see [[J-Integral Evaluation Methods (Overview)]])
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*[[Peel-Cling Test Cyclic]]
*[[Peel-Cling Test Cyclic]]
*[[Peel-Cling Test Extented]]
*[[Peel-Cling Test Extented]]
*Peel Curve (see [[Peel Force – Fracture Path Diagram]])
*[[Peel Force]]
*[[Peel Force]]
*[[Peel Force – Fracture Path Diagram]]
*[[Peel Force – Fracture Path Diagram]]
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*Piezoelectric Effect (see [[Piezoelectric Force Transducer]] and [[Piezo Ceramics]])
*Piezoelectric Effect (see [[Piezoelectric Force Transducer]] and [[Piezo Ceramics]])
*[[Piezoelectric Force Transducer]]
*[[Piezoelectric Force Transducer]]
*PLANCK's constant (see [[Resolution Microscope]])
*[[Plane Stress and Strain State]]
*[[Plane Stress and Strain State]]
*[[Plastic Component]]
*[[Plastic Component]]
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*[[Radusch, Hans-Joachim]]
*[[Radusch, Hans-Joachim]]
*[[Ramps, Clods and Steps]]
*[[Ramps, Clods and Steps]]
*[[Raster Reflection Method]]
*R-Curve Concept (see [[Crack Resistance (R) Curve]])
*R-Curve Concept (see [[Crack Resistance (R) Curve]])
*[[Rebound Resilience Elastomers]]
*[[Rebound Resilience Elastomers]]
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*[[Relaxation Behaviour Determination]]
*[[Relaxation Behaviour Determination]]
*[[Relaxation Plastics]]
*[[Relaxation Plastics]]
*Residual Compressive Strength (see [[Compression After Impact Test]])
*Residual Stress ( see [[Tensile Test Residual Stresses Orientations]])
*Residual Stress ( see [[Tensile Test Residual Stresses Orientations]])
*[[Resolution Laser Extensometer Device System]]
*[[Resolution Material Testing Machine]]
*[[Resolution Material Testing Machine]]
*[[Resolution Microscope]]
*[[Resolution Microscope]]
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*Rise Time Electronic Measuring Chain (see [[ICIT – Experimental Conditions]])
*Rise Time Electronic Measuring Chain (see [[ICIT – Experimental Conditions]])
*[[ROCKWELL Hardness]]
*[[ROCKWELL Hardness]]
*[[Roll Ring Test]]
*[[Round Specimen]]
*[[Round Specimen]]
*[[Round Robin Test]]
*[[Round Robin Test]]
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*[[Scanning Acoustic Microscopy (SAM)]]
*[[Scanning Acoustic Microscopy (SAM)]]
*[[Scanning Electron Microscopy]] (SEM)
*[[Scanning Electron Microscopy]] (SEM)
*[[SCB specimen]]
*[[Scratch Hardness]]
*[[Scratch Hardness]]
*[[Scratch Resistance]]
*[[Scratch Resistance]]
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*[[Smart Materials]]
*[[Smart Materials]]
*SNEDDON-Williams-Equations (see [[Crack Model according to GRIFFITH]])
*SNEDDON-Williams-Equations (see [[Crack Model according to GRIFFITH]])
*SNELLIUS' Law of Refraction (see [[Ultrasonic Birefringence]] and [[Ultrasonic Angle Beam Sensors]])
*SNELLIUS' Law of Refraction (see [[Ultrasonic Birefringence]], [[Ultrasonic Angle Beam Sensors]] and [[Refraction Light]])
*Sonography (see [[Ultrasound Testing]])
*Sonography (see [[Ultrasound Testing]])
*Sound Absorption Coefficient (see [[Elastic Modulus]])
*Sound Absorption Coefficient (see [[Elastic Modulus]])
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*[[Specimen Compliance]]
*[[Specimen Compliance]]
*[[Specimen for Fracture Mechanics Tests]]
*[[Specimen for Fracture Mechanics Tests]]
*[[Specimen for Laser Sintering]]
*Specimen Shapes For Fatigue Tests (see [[Test Specimen for Fatigue Tests]])
*Specimen Shapes For Fatigue Tests (see [[Test Specimen for Fatigue Tests]])
*Speed (see [[Velocity]])
*Speed (see [[Velocity]])
*[[Spherulitic Structure]]
*[[Spherulitic Structure]]
*SPLIT-HOPKINSON Pressure Bar (SHPB) Test (see [[Strain Rate Applications]])
*[[Squirter Technique]]
*[[Squirter Technique]]
*Stability Time (see [[Thermostability PVC]])
*Stability Time (see [[Thermostability PVC]])
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*[[Test Climate]]
*[[Test Climate]]
*[[Testing]]
*[[Testing]]
*Testing of Adhesive Bonds (see [[SCB-Specimen]])
*Testing of Composite Materials (see [[Composite Materials Testing]])
*Testing of Composite Materials (see [[Composite Materials Testing]])
*[[Testing Microcomponents]]
*[[Testing Microcomponents]]
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*[[Time–Temperature Shift Law]]
*[[Time–Temperature Shift Law]]
*Titration Method (see [[Density]])
*Titration Method (see [[Density]])
*TODCB-Specimen (see [[SCB-Specimen]])
*[[Toughness]]
*[[Toughness]]
*[[Toughness Temperature Dependence]]
*[[Toughness Temperature Dependence]]
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*[[Universal Hardness]]
*[[Universal Hardness]]
*Universal Testing Machine (see [[Material Testing Machine]])
*Universal Testing Machine (see [[Material Testing Machine]])
*UODCB-Specimen (see [[SCB-Specimen]])
}}
}}



Latest revision as of 14:25, 9 January 2026

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