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Line 13: Line 13:
*Absorption Light (see [[Light Absorption]])
*Absorption Light (see [[Light Absorption]])
*[[Absorption Sound Waves]]
*[[Absorption Sound Waves]]
*[[Accuracy Class]]
*[[Acoustic Emission]]
*[[Acoustic Emission]]
*Acoustic Microscopy (see [[Scanning Acoustic Microscopy (SAM)]])
*Acoustic Microscopy (see [[Scanning Acoustic Microscopy (SAM)]])
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*[[Ball Indentation Hardness]]
*[[Ball Indentation Hardness]]
*Ball Indentation Hardness IRHD (see [[IRHD Hardness]])
*Ball Indentation Hardness IRHD (see [[IRHD Hardness]])
*[[Ball or Pin Impression Method]]
*[[Ball or Pin-Impression Method]]
*BARENBLATT Crack Model (see [[Crack Model according to BARENBLATT]])
*BARENBLATT Crack Model (see [[Crack Model according to BARENBLATT]])
*[[Barrier Plastics]]
*[[Barrier Plastics]]
Line 52: Line 53:
* Bending Stiffness (see [[Stiffness]] and [[Bend Test Compliance]])
* Bending Stiffness (see [[Stiffness]] and [[Bend Test Compliance]])
*[[Bend Loading]]
*[[Bend Loading]]
*[[Bend Strip Method]]
*[[Bend Test]]
*[[Bend Test]]
*[[Bend Test and Light Microscopy]]
*[[Bend Test and Light Microscopy]]
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*[[Bend Test – Test Influences]]
*[[Bend Test – Test Influences]]
*[[Bend Test – Yield Stress]]
*[[Bend Test – Yield Stress]]
*[[Bent Strip Method]]
*[[Bierögel, Christian]]
*[[Bierögel, Christian]]
*[[Bio-Plastics]]
*[[Bio-Plastics]]
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*Blunting Crack Tip (see [[Stretch Zone]], [[in-situ Tensile Test in ESEM with AE]] and [[Crack Opening]])
*Blunting Crack Tip (see [[Stretch Zone]], [[in-situ Tensile Test in ESEM with AE]] and [[Crack Opening]])
*[[BOLTZMANN's Superposition Principle]]
*[[BOLTZMANN's Superposition Principle]]
*Boundary Surface (see [[Phase Boundary Surface]])
*[[Brittle Fracture Promoting Factors]]
*[[Brittle Fracture Promoting Factors]]
*[[Brittle-Tough Transition]]
*[[Brittle-Tough Transition]]
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*Clamping Jaws (see [[Specimen Clamping]])
*Clamping Jaws (see [[Specimen Clamping]])
*Clip-on Strain Gauge (see [[Tensile Test#Tensile test, path measurement technique|Tensile Test, Path Measurement Technique]])
*Clip-on Strain Gauge (see [[Tensile Test#Tensile test, path measurement technique|Tensile Test, Path Measurement Technique]])
*[[CLS-Specimen]]
*Cohesive Strength (see [[Fracture]])
*Cohesive Strength (see [[Fracture]])
*Cold Stretching (see [[Tensile Test]])
*Cold Stretching (see [[Tensile Test]])
*[[Colour]]
*[[Colour]]
*[[Colour Penetration Test]]
*[[Colour Penetration Test]]
*[[Compact Tension (CT) Specimen]]
*[[Compact Tension Specimen]]
*[[Compact Tension Shear (CTS) Specimen]]
*[[Compact Tension Shear (CTS) Specimen]]
*Comparative Tracking Index (CTI) (see [[Creep Current Resistance]])
*Comparative Tracking Index (CTI) (see [[Creep Current Resistance]])
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*[[C-shaped Test Specimen]]
*[[C-shaped Test Specimen]]
*[[C-Scan Technique]]
*[[C-Scan Technique]]
*CT-Specimen (see [[Compact Tension (CT) Specimen]])
*[[CT-Specimen]]
*[[CTS-Specimen]]
*[[Curing]]
*[[Curing]]
}}
}}
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*Damage Analysis of Plastic Products (see [[Failure Analysis Plastics Products, VDI Guideline 3822]])
*Damage Analysis of Plastic Products (see [[Failure Analysis Plastics Products, VDI Guideline 3822]])
*[[DCB-Specimen]] (Double-Cantilever Beam)
*[[DCB-Specimen]] (Double-Cantilever Beam)
*De BROGLIE equation (see [[Resolution Microscope]])
*Defect Density (see [[Tensile Test Event-related Interpretation]])
*Defect Density (see [[Tensile Test Event-related Interpretation]])
*[[Deformation]]
*[[Deformation]]
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*[[Fatigue Strength]]
*[[Fatigue Strength]]
*[[Fatigue Crack Propagation Elastomers]]
*[[Fatigue Crack Propagation Elastomers]]
*Fibre Formation (see [[Fracture Types]], [[Craze Types]] and [[Fracture Parables]])
*[[Fibre–Matrix Adhesion]]
*[[Fibre–Matrix Adhesion]]
*[[Fibre-reinforced Plastics]]
*[[Fibre-reinforced Plastics]]
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*[[Fracture Types]]
*[[Fracture Types]]
*[[Free Falling Dart Method]]
*[[Free Falling Dart Method]]
*[[Freezing-Time]]
*[[Frequency Analysis]]
*[[Frequency Analysis]]
*[[Frequency Response Control]]
*Friction (see [[Bend Test – Influences]])
*Friction (see [[Bend Test – Influences]])
*[[Friction Force]]
*[[Friction Force]]
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== L ==
== L ==
{{Mehrspaltige Liste |breite=30em |liste=
{{Mehrspaltige Liste |breite=30em |liste=
*Lamb Waves (see [[Ultrasonic Plate Waves Sensors]])
*LAMBERT-BEER's Law (see [[Light Absorption]])
*LAMBERT-BEER's Law (see [[Light Absorption]])
*[[Laser Angle-Scanner]]
*[[Laser Angle-Scanner]]
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*[[Laser Parallel-Scanner]]
*[[Laser Parallel-Scanner]]
*[[Layer Silicate-reinforced Polymers]]
*[[Layer Silicate-reinforced Polymers]]
*[[Laser Sintering Process]]
*[[Laser TMA-Scanner]]
*[[Laser TMA-Scanner]]
*[[Levels of Knowledge in Fracture Mechanics]]
*[[Levels of Knowledge in Fracture Mechanics]]
*[[Light Absorption]]
*[[Light Absorption]]
*[[Light Remission]]
*[[Light Transmission]]
*Linear-elastic Fracture Mechanics (LEFM) (see [[Fracture Mechanics]])
*Linear-elastic Fracture Mechanics (LEFM) (see [[Fracture Mechanics]])
*[[Linear-viscoelastic Behaviour]]
*[[Linear-viscoelastic Behaviour]]
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*[[Machine Compliance]]
*[[Machine Compliance]]
*[[Macrodispersion Degree Elastomers]]
*[[Macrodispersion Degree Elastomers]]
*[[Magnification Microscope]]
*[[Manufacturer of Material Testing Machines]]
*[[Manufacturer of Material Testing Machines]]
*[[Martens, Adolf]]
*[[Martens, Adolf]]
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*Melt Flow Index (see [[Melt Mass-Flow Rate]] and [[Melt Volume-Flow Rate]])
*Melt Flow Index (see [[Melt Mass-Flow Rate]] and [[Melt Volume-Flow Rate]])
*[[Melt Mass-Flow Rate]]
*[[Melt Mass-Flow Rate]]
*Melt Temperatur (see [[Differential Scanning Calorimetry (DSC)]] and [[Crystallinity]])
*[[Melt Volume-Flow Rate]]
*[[Melt Volume-Flow Rate]]
*[[Menges, Georg]]
*[[Menges, Georg]]
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*Microcrack (see [[Crack]])
*Microcrack (see [[Crack]])
*[[Micro-Damage Limit]]
*[[Micro-Damage Limit]]
*Mcrohardness (see [[Hardness]])
*Microhardness (see [[Hardness]])
*Micro-IRHD (see [[IRHD Hardness]])
*Micro-IRHD (see [[IRHD Hardness]])
*[[Micromechanics & Nanomechanics]]
*[[Micromechanics & Nanomechanics]]
*[[Microplastic & Nanoplastic]]
*[[Micropores]]
*[[Micropores]]
*[[Microscopic Structure]]
*[[Microscopic Structure]]
Line 485: Line 500:
*Normative Strain (see [[Tensile Strength]])
*Normative Strain (see [[Tensile Strength]])
*[[Notch]]
*[[Notch]]
*[[Notched Impact Test]]
*[[Notched Tensile Impact Test]]
*[[Notch Geometry]]
*[[Notch Geometry]]
*Notch Impact Strength (see [[Notched Impact Test]])
*Notch Impact Strength (see [[Notched Impact Test]])
*Notch Insertion (see [[Notching]])
*Notch Insertion (see [[Notching]])
*[[Notch Sensitivity]]
*[[Notched Impact Test]]
*[[Notched Tensile Impact Test]]
*[[Notching]]
*[[Notching]]
*[[Notch Sensitivity]]
*[[Nuclear Magnetic Resonance Spectroscopy]] (NMR Spectroscopy)
*[[Nuclear Magnetic Resonance Spectroscopy]] (NMR Spectroscopy)
}}
}}
Line 497: Line 512:
== O ==
== O ==
{{Mehrspaltige Liste |breite=30em |liste=
{{Mehrspaltige Liste |breite=30em |liste=
*[[Object Raster Method]]
*Orientation (see [[Tensile Test Residual Stresses Orientations]])
*Orientation (see [[Tensile Test Residual Stresses Orientations]])
*Overview about J-Integral Evaluation Methods (see [[J-Integral Evaluation Methods (Overview)]])
*Overview about J-Integral Evaluation Methods (see [[J-Integral Evaluation Methods (Overview)]])
Line 510: Line 526:
*[[Peel-Cling Test]]
*[[Peel-Cling Test]]
*[[Peel-Cling Test Cyclic]]
*[[Peel-Cling Test Cyclic]]
*[[Peel-Cring Test Extented]]
*[[Peel-Cling Test Extented]]
*Peel Curve (see [[Peel Force – Fracture Path Diagram]])
*[[Peel Force]]
*[[Peel Force]]
*[[Peel Force – Fracture Path Diagram]]
*[[Peel Force – Fracture Path Diagram]]
Line 524: Line 541:
*Piezoelectric Effect (see [[Piezoelectric Force Transducer]] and [[Piezo Ceramics]])
*Piezoelectric Effect (see [[Piezoelectric Force Transducer]] and [[Piezo Ceramics]])
*[[Piezoelectric Force Transducer]]
*[[Piezoelectric Force Transducer]]
*PLANCK's constant (see [[Resolution Microscope]])
*[[Plane Stress and Strain State]]
*[[Plane Stress and Strain State]]
*[[Plastic Component]]
*Plastic Deformation (see [[Deformation]])
*Plastic Deformation (see [[Deformation]])
*[[Plastic Films & Varnishes – Surface Technology]]
*[[Plastic Films & Varnishes – Surface Technology]]
*[[Plastic Component]]
*Plastic Deformation (see [[Deformation]])
*[[Plastics]]
*[[Plastics]]
*[[Plastics – Symbols and Abbreviated Terms]]
*[[Plastics – Symbols and Abbreviated Terms]]
Line 559: Line 576:
*[[Radusch, Hans-Joachim]]
*[[Radusch, Hans-Joachim]]
*[[Ramps, Clods and Steps]]
*[[Ramps, Clods and Steps]]
*[[Raster Reflection Method]]
*R-Curve Concept (see [[Crack Resistance (R) Curve]])
*[[Rebound Resilience Elastomers]]
*[[Rebound Resilience Elastomers]]
*[[Reflection Light]]
*[[Reflection Light]]
*[[Reflection Sound Waves]]
*Reflection Sound Waves (see [[Ultrasonic Waves Reflection]])
*[[Refraction Index]]
*[[Refraction Index]]
*Refraction Law (see [[Refraction Light]] and [[Refraction Sound Waves]])
*Refraction Law (see [[Refraction Light]] and [[Refraction Sound Waves]])
Line 570: Line 589:
*[[Relaxation Behaviour Determination]]
*[[Relaxation Behaviour Determination]]
*[[Relaxation Plastics]]
*[[Relaxation Plastics]]
*Residual Compressive Strength (see [[Compression After Impact Test]])
*Residual Stress ( see [[Tensile Test Residual Stresses Orientations]])
*Residual Stress ( see [[Tensile Test Residual Stresses Orientations]])
*[[Resolution Laser Extensometer Device System]]
*[[Resolution Material Testing Machine]]
*[[Resolution Material Testing Machine]]
*[[Resolution Microscope]]
*[[Resolution Microscope]]
Line 577: Line 598:
*Rise Time Electronic Measuring Chain (see [[ICIT – Experimental Conditions]])
*Rise Time Electronic Measuring Chain (see [[ICIT – Experimental Conditions]])
*[[ROCKWELL Hardness]]
*[[ROCKWELL Hardness]]
*[[Roll Ring Test]]
*[[Round Specimen]]
*[[Round Specimen]]
*[[Round Robin Test]]
*[[Round Robin Test]]
Line 585: Line 607:
*[[Scanning Acoustic Microscopy (SAM)]]
*[[Scanning Acoustic Microscopy (SAM)]]
*[[Scanning Electron Microscopy]] (SEM)
*[[Scanning Electron Microscopy]] (SEM)
*[[SCB specimen]]
*[[Scratch Hardness]]
*[[Scratch Hardness]]
*[[Scratch Resistance]]
*[[Scratch Resistance]]
Line 612: Line 635:
*[[Smart Materials]]
*[[Smart Materials]]
*SNEDDON-Williams-Equations (see [[Crack Model according to GRIFFITH]])
*SNEDDON-Williams-Equations (see [[Crack Model according to GRIFFITH]])
*SNELLIUS' Law of Refraction (see [[Ultrasonic Birefringence]], [[Ultrasonic Angle Beam Sensors]] and [[Refraction Light]])
*Sonography (see [[Ultrasound Testing]])
*Sonography (see [[Ultrasound Testing]])
*Sound Absorption Coefficient (see [[Elastic Modulus]])
*Sound Absorption Coefficient (see [[Elastic Modulus]])
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*[[Specimen Compliance]]
*[[Specimen Compliance]]
*[[Specimen for Fracture Mechanics Tests]]
*[[Specimen for Fracture Mechanics Tests]]
*[[Specimen for Laser Sintering]]
*Specimen Shapes For Fatigue Tests (see [[Test Specimen for Fatigue Tests]])
*Specimen Shapes For Fatigue Tests (see [[Test Specimen for Fatigue Tests]])
*Speed (see [[Velocity]])
*Speed (see [[Velocity]])
*[[Spherulitic Structure]]
*[[Spherulitic Structure]]
*SPLIT-HOPKINSON Pressure Bar (SHPB) Test (see [[Strain Rate Applications]])
*[[Squirter Technique]]
*[[Squirter Technique]]
*Stability Time (see [[Thermostability PVC]])
*Stability Time (see [[Thermostability PVC]])
Line 684: Line 710:
*[[Test Climate]]
*[[Test Climate]]
*[[Testing]]
*[[Testing]]
*Testing of Adhesive Bonds (see [[SCB-Specimen]])
*Testing of Composite Materials (see [[Composite Materials Testing]])
*Testing of Composite Materials (see [[Composite Materials Testing]])
*[[Testing Microcomponents]]
*[[Testing Microcomponents]]
Line 709: Line 736:
*[[Time–Temperature Shift Law]]
*[[Time–Temperature Shift Law]]
*Titration Method (see [[Density]])
*Titration Method (see [[Density]])
*TODCB-Specimen (see [[SCB-Specimen]])
*[[Toughness]]
*[[Toughness]]
*[[Toughness Temperature Dependence]]
*[[Toughness Temperature Dependence]]
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*[[Ultrasonic Direct Coupling]]
*[[Ultrasonic Direct Coupling]]
*Ultrasonic Imaging Inspection (see [[Imaging Ultrasonic Testing]])
*Ultrasonic Imaging Inspection (see [[Imaging Ultrasonic Testing]])
*[[Ultrasonic Laser Excitation]]
*[[Ultrasonic Immersion Bath Technique]]
*[[Ultrasonic Immersion Bath Technique]]
*[[Ultrasonic Immersion Bath Sensors]]
*[[Ultrasonic Immersion Bath Sensors]]
*[[Ultrasonic Laser Excitation]]
*Ultrasonic Microscopy (see [[Scanning Acoustic Microscopy (SAM)]])
*Ultrasonic Microscopy (see [[Scanning Acoustic Microscopy (SAM)]])
*[[Ultrasonic Modulation]]
*[[Ultrasonic Modulation]]
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*[[Ultrasonic Transmission Technique]]
*[[Ultrasonic Transmission Technique]]
*[[Ultrasonic Transmitter(S)-Receiver(E) Sensors]]
*[[Ultrasonic Transmitter(S)-Receiver(E) Sensors]]
*[[Ultrasonic Plate Waves Sensors]]
*[[Ultrasonic Wall Thickness Measurement]]
*[[Ultrasonic Wall Thickness Measurement]]
*[[Ultrasonic Waves Reflection]]
*[[Ultrasonic Waves Reflection]]
*[[Ultrasonic Weld Inspection]]
*[[Ultrasonic Weld Inspection]]
*[[Ultrasound – Elastic Parameters]]
*[[Ultrasound – Elastic Parameters]]
*[[Ultrasound Guided Waves]]
*[[Ultrasound Testing]]
*[[Ultrasound Testing]]
*[[Uniaxial Stress State]]
*[[Uniaxial Stress State]]
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*[[Universal Hardness]]
*[[Universal Hardness]]
*Universal Testing Machine (see [[Material Testing Machine]])
*Universal Testing Machine (see [[Material Testing Machine]])
*UODCB-Specimen (see [[SCB-Specimen]])
}}
}}


Line 811: Line 842:
*[[:Category:Creep Behaviour Plastics|Creep Behaviour Plastics]]
*[[:Category:Creep Behaviour Plastics|Creep Behaviour Plastics]]
*[[:Category:Damage Analysis_Component Failure|Damage Analysis/Component Failure]]
*[[:Category:Damage Analysis_Component Failure|Damage Analysis/Component Failure]]
*[[:Category:Deformation engl|Deformation]]
*[[:Category:Deformation|Deformation]]
*[[:Category:Elastomers|Elastomers]]
*[[:Category:Elastomers|Elastomers]]
*[[:Category:Electrical and Dielectrical Testing|Electrical and Dielectrical Testing]]
*[[:Category:Electrical and Dielectrical Testing|Electrical and Dielectrical Testing]]

Latest revision as of 14:25, 9 January 2026

Welcome to the PSM Wiki-lexicon "Polymer Testing & Diagnostics" from Polymer Service GmbH Merseburg (PSM)!

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