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*Absorption Light (see [[Light Absorption]])
*Absorption Light (see [[Light Absorption]])
*[[Absorption Sound Waves]]
*[[Absorption Sound Waves]]
*[[Accuracy Class]]
*[[Acoustic Emission]]
*[[Acoustic Emission]]
*Acoustic Microscopy (see [[Scanning Acoustic Microscopy (SAM)]])
*Acoustic Microscopy (see [[Scanning Acoustic Microscopy (SAM)]])
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*[[Alpha ROCKWELL Hardness]]
*[[Alpha ROCKWELL Hardness]]
*[[Altstädt, Volker]]
*[[Altstädt, Volker]]
*[[Angle Specimen|Angle specimen]]
*Anisotropic Deformation (see [[Deformation]])
*Anisotropic Deformation (see [[Deformation]])
*[[Anisotropy]]
*[[Anisotropy]]
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*[[Ball or Pin Impression Method]]
*[[Ball or Pin Impression Method]]
*BARENBLATT Crack Model (see [[Crack Model according to BARENBLATT]])
*BARENBLATT Crack Model (see [[Crack Model according to BARENBLATT]])
*[[Barcol Hardness]]
*[[Barrier Plastics]]
*[[Barrier Plastics]]
*[[Barcol Hardness]]
*BCS Crack Model (see [[Crack Models]])
*BCS Crack Model (see [[Crack Models]])
*[[BEGLEY and LANDES – J-Integral Estimation Method]]
*[[BEGLEY and LANDES – J-Integral Estimation Method]]
* Bending Stiffness (see [[Stiffness]] and [[Bend Test Compliance]])
* Bending Stiffness (see [[Stiffness]] and [[Bend Test Compliance]])
*[[Bend Loading]]
*[[Bend Loading]]
*[[Bend Strip Method]]
*[[Bend Test]]
*[[Bend Test]]
*[[Bend Test and Light Microscopy]]
*[[Bend Test and Light Microscopy]]
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*[[Bend Test – Test Influences]]
*[[Bend Test – Test Influences]]
*[[Bend Test – Yield Stress]]
*[[Bend Test – Yield Stress]]
*[[Bent Strip Method]]
*[[Bierögel, Christian]]
*[[Bierögel, Christian]]
*[[Bio-Plastics]]
*[[Bio-Plastics]]
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*Blunting Crack Tip (see [[Stretch Zone]], [[in-situ Tensile Test in ESEM with AE]] and [[Crack Opening]])
*Blunting Crack Tip (see [[Stretch Zone]], [[in-situ Tensile Test in ESEM with AE]] and [[Crack Opening]])
*[[BOLTZMANN's Superposition Principle]]
*[[BOLTZMANN's Superposition Principle]]
*Boundary Surface (see [[Phase Boundary Surface]])
*[[Brittle Fracture Promoting Factors]]
*[[Brittle Fracture Promoting Factors]]
*[[Brittle-Tough Transition]]
*[[Brittle-Tough Transition]]
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*[[Campus®]]
*[[Campus®]]
*[[Capillary Rheometer]]
*[[Capillary Rheometer]]
*[[Ceramography]]
*Characteristic Values (see [[Material Value]])
*Characteristic Values (see [[Material Value]])
*[[Charpy, Georges]]
*Charpy Impact Test (see [[Impact Test]])
*Charpy Impact Test (see [[Impact Test]])
*[[Charpy Testing]]
*[[Charpy Testing]]
*Clamping Jaws (see [[Specimen Clamping]])
*Clamping Jaws (see [[Specimen Clamping]])
*Clip-on Strain Gauge (see [[Tensile Test#Tensile test, path measurement technique|Tensile Test, Path Measurement Technique]])
*Clip-on Strain Gauge (see [[Tensile Test#Tensile test, path measurement technique|Tensile Test, Path Measurement Technique]])
*[[CLS-Specimen]]
*Cohesive Strength (see [[Fracture]])
*Cohesive Strength (see [[Fracture]])
*[[Cohesive Zone Models]]
*Cold Stretching (see [[Tensile Test]])
*Cold Stretching (see [[Tensile Test]])
*[[Colour]]
*[[Colour]]
*[[Colour Difference]]
*[[Colour Penetration Test]]
*[[Colour Penetration Test]]
*[[Compact Tension (CT) Specimen]]
*[[Compact Tension Specimen]]
*[[Compact Tension Shear (CTS) Specimen]]
*[[Compact Tension Shear (CTS) Specimen]]
*Comparative Tracking Index (CTI) (see [[Creep Current Resistance]])
*Comparative Tracking Index (CTI) (see [[Creep Current Resistance]])
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*[[Compression After Impact Test]]
*[[Compression After Impact Test]]
*[[Compression Hardness]]
*[[Compression Hardness]]
*[[Compression Strength]]
*[[Compressive Strength]]
*[[Compression Test]]
*[[Compression Test]]
*[[Compression Test Arrangement]]
*[[Compression Test Arrangement]]
*[[Compression Test Compliance]]  
*[[Compression Test Compliance]]
*Compressive and Buckling Stiffness (see [[Stiffness]])
*Compressive and Buckling Stiffness (see [[Stiffness]])
*Constraint Factor (see [[J-Integral Concept]] and [[Toughness Temperature Dependence]])
*Constraint Factor (see [[J-Integral Concept]] and [[Toughness Temperature Dependence]])
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*[[Correspondence Principle]]
*[[Correspondence Principle]]
*[[Crack]]
*[[Crack]]
*[[Crack Formation]]
*Crack Formation (see [[Fracture Formation]])
*Crack Growth (see [[Crack Propagation]])
*Crack Growth (see [[Crack Propagation]])
*[[Crack Initiation]]
*[[Crack Initiation]]
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*[[Crack Model according to GRIFFITH]]
*[[Crack Model according to GRIFFITH]]
*[[Crack Model according to IRWIN and Mc CLINTOCK]]
*[[Crack Model according to IRWIN and Mc CLINTOCK]]
*[[Crack Opening]]  
*[[Crack Opening]]
*[[Crack Opening Modes]]  
*[[Crack Opening Modes]]
*[[Crack Propagation]]
*[[Crack Propagation]]
*[[Crack Propagation Energy]]  
*[[Crack Propagation Energy]]
*[[Crack Propagation Stress Corrosion Cracking]]
*[[Crack Resistance (R) Curve]]
*[[Crack Resistance (R) Curve]]
*[[Crack Resistance Curve – Examples]]
*[[Crack Resistance Curve – Examples]]
*[[Crack Resistance Curve – Experimental Methods]]
*[[Crack Resistance Curve – Experimental Methods]]
*[[Crack Resistance Curve – Elastomers Quasistatic]]  
*[[Crack Resistance Curve – Elastomers Quasistatic]]
*[[Crack Tip Opening Displacement Concept (CTOD)]]  
*[[Crack Tip Opening Displacement Concept (CTOD)]]
*[[Crack Toughness]]  
*[[Crack Toughness]]
*[[Craze-Types]]  
*[[Craze-Types]]
*Craze (see [[Micromechanics & Nanomechanics]])
*Craze (see [[Micromechanics & Nanomechanics]])
*[[Crazing]]
*[[Crazing]]
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*[[Creep Behaviour – Determination]]
*[[Creep Behaviour – Determination]]
*[[Creep Behaviour – Flexural Creep Test]]
*[[Creep Behaviour – Flexural Creep Test]]
*[[Creep Behaviour – Creep Internal Compression Test]]
*[[Creep Behaviour – Creep Compression Test]]
*[[Creep Behaviour – Recovery Test]]
*[[Creep Behaviour – Recovery Test]]
*[[Creep Behaviour – Tensile Creep Test]]
*[[Creep Behaviour – Tensile Creep Test]]
*[[Creep Compression Test]]  
*[[Creep Compression Test]]
*[[Creep Current Resistance]]
*[[Creep Current Resistance]]
*Creep Modul (see [[Creep Behaviour – Determination]])
*Creep Modulus (see [[Creep Behaviour – Determination]])
*Creep Path Formation (see [[Tracking]])
*Creep Path Formation (see [[Tracking]])
*[[Creep Plastics]]
*[[Creep Plastics]]
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*[[Crosshead Speed]]
*[[Crosshead Speed]]
*[[Crystallinity]]
*[[Crystallinity]]
*[[Cross-linking Elastomers]]  
*[[Cross-linking Elastomers]]
*[[C-shaped Test Specimen]]
*[[C-shaped Test Specimen]]
*[[C-Scan Technique]]
*[[C-Scan Technique]]
*CT-Specimen (see [[Compact Tension (CT) Specimen]])
*[[CT-Specimen]]
*[[CTS-Specimen]]
*[[Curing]]
*[[Curing]]
}}
}}
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*Damage Analysis of Plastic Products (see [[Failure Analysis Plastics Products, VDI Guideline 3822]])
*Damage Analysis of Plastic Products (see [[Failure Analysis Plastics Products, VDI Guideline 3822]])
*[[DCB-Specimen]] (Double-Cantilever Beam)
*[[DCB-Specimen]] (Double-Cantilever Beam)
*De BROGLIE equation (see [[Resolution Microscope]])
*Defect Density (see [[Tensile Test Event-related Interpretation]])
*Defect Density (see [[Tensile Test Event-related Interpretation]])
*[[Deformation]]
*[[Deformation]]
*[[Deformation Mechanisms]]  
*[[Deformation Behaviour of Human Cartilage]]
*[[Deformation Mechanisms]]
*[[Deformation Rate]]
*[[Deformation Rate]]
*[[Deformation Velocity]]
*[[Deformation Velocity]]
*[[Degree of Cross-Linking Elastomers]]  
*[[Degree of Cross-Linking Elastomers]]
*[[Density]]
*[[Density]]
*[[DENT-Specimen]] (Double Edge-Notched Tension Specimen)
*[[Depth of Field Microscope]]
*[[Depth of Field Microscope]]
*[[Dielectric Loss Factor]]  
*[[Dielectric Loss Factor]]
*[[Dielectric Properties]]
*[[Dielectric Properties]]
*[[Differential Scanning Calorimetry (DSC)]]
*[[Differential Scanning Calorimetry (DSC)]]
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*[[Dynamic-mechanical Analysis (DMA) – Bend Loading]]
*[[Dynamic-mechanical Analysis (DMA) – Bend Loading]]
*[[Dynamic-mechanical Analysis (DMA) – Tensile Stress]]
*[[Dynamic-mechanical Analysis (DMA) – Tensile Stress]]
*[[Dynamic-mechanical Analysis (DMA) – Tensile Test]]
*[[Dynamic-mechanical Analysis (DMA) – Torsional Stress]]
*[[Dynamic-mechanical Analysis (DMA) – Torsional Stress]]
*Dynstat Impact Test (see [[Impact Test]])
*Dynstat Impact Test (see [[Impact Test]])
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*[[Effective Crack Length]]
*[[Effective Crack Length]]
*[[Ehrenstein, Gottfried W.]]
*[[Ehrenstein, Gottfried W.]]
*[[Elasticity]]  
*[[Elasticity]]
*[[Elastic Modulus]]
*[[Elastic Modulus]]
*[[Elastic Modulus – Examples and Material Values]]
*[[Elastic Modulus – Examples and Material Values]]
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*[[Electronic Instrumentation]]
*[[Electronic Instrumentation]]
*[[Electronic Speckle Pattern Interferometry (ESPI)]]
*[[Electronic Speckle Pattern Interferometry (ESPI)]]
*Electrostatic Discharge (ESD) (see [[Electrical Conductivity]])
*Elongation at Break (see [[Tensile Strength]])
*Elongation at Break (see [[Tensile Strength]])
*[[Elongational Viscosity]]
*[[ELS-Specimen]]
*Emission (see [[Acoustic Emission]])
*Emission (see [[Acoustic Emission]])
*[[ENF-Specimen]] (End-Notched Flexure)
*[[ENF-Specimen]] (End-Notched Flexure)
*[[4 End-Notched Flexure Specimen]]
*[[Energy Balance ICIT]]
*[[Energy Dispersive X-Ray Spectroscopy (EDX)]]
*[[Energy Dispersive X-Ray Spectroscopy (EDX)]]
*[[Energy Elasticity]]
*[[Energy Elasticity]]
*Energy Fracture Criterion (see [[Energy Release Rate]])
*[[Energy Release Rate]]
*[[Energy Release Rate]]
*Entanglements (see [[Polymers & Structure]], [[Entropy Elasticity]] and [[Degree of Cross-Linking Elastomers]])
*Entanglements (see [[Polymers & Structure]], [[Entropy Elasticity]] and [[Degree of Cross-Linking Elastomers]])
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*[[Errors]]
*[[Errors]]
*[[Error Limit]]
*[[Error Limit]]
*[[Essential Work of Fracture (EWF)-Concept]]
*EULER's Buckling (see [[Stiffness]])
*EULER's Buckling (see [[Stiffness]])
*Exfoliation (see [[Laser Silicate-reinforced Polymers]])
*Exfoliation (see [[Laser Silicate-reinforced Polymers]])
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*[[Fatigue Strength]]
*[[Fatigue Strength]]
*[[Fatigue Crack Propagation Elastomers]]
*[[Fatigue Crack Propagation Elastomers]]
*[[Fibre Agglomeration]]
*Fibre Formation (see [[Fracture Types]], [[Craze-Types]] and [[Fracture Parables]])
*[[Fibre–Matrix Adhesion]]
*[[Fibre–Matrix Adhesion]]
*[[Fibre-reinforced Plastics]]
*[[Fibre-reinforced Plastics]]
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*Fibre Content (see [[Ashing Method]])
*Fibre Content (see [[Ashing Method]])
*Fibrillation (see [[Crazing]], [[Craze-Types]] and [[Multiple Crazing]])
*Fibrillation (see [[Crazing]], [[Craze-Types]] and [[Multiple Crazing]])
*[[Fixed-arm Peel Test]]
*Filler (see [[Particle-filled Thermoplastics]])
*Filler (see [[Particle-filled Thermoplastics]])
*[[Film Testing]]
*[[Film Testing]]
*[[Fixed-arm Peel Test]]
*[[Flammability]]
*[[Flexural Creep Test]]
*[[Flexural Creep Test]]
*[[Flexural Modulus]]
*[[Flexural Modulus]]
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*FLORY-HUGGINS Interaction Parameter (see [[Degree of Cross-Linking Elastomers]])
*FLORY-HUGGINS Interaction Parameter (see [[Degree of Cross-Linking Elastomers]])
*FLORY-REHNER Theory (see [[Degree of Cross-Linking Elastomers]])
*FLORY-REHNER Theory (see [[Degree of Cross-Linking Elastomers]])
*Four End-Notched Flexure (4ENF)Specimen (see [[4 ENF-Specimen]])
*Four Point Bend Test (see [[Bend Test]] and [[Bend Test – Influences]])
*Four Point Bend Test (see [[Bend Test]] and [[Bend Test – Influences]])
*[[Fractography]]
*[[Fracture]]
*[[Fracture]]
*[[Fractography]]
*[[Fracture Behaviour]]
*[[Fracture Behaviour]]
*[[Fracture Behaviour of Plastics Components]]
*[[Fracture Behaviour of Plastics Components]]
*Fracture Criterion (see [[Energy Release Rate]])
*Fracture Energy (see [[Fracture Formation]] and [[Fracture]])
*Fracture Energy (see [[Fracture Formation]] and [[Fracture]])
*[[Fracture Formation]]
*[[Fracture Formation]]
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*[[Fracture Safety Criterion]]
*[[Fracture Safety Criterion]]
*[[Fracture Surface]]
*[[Fracture Surface]]
*Fracture Time (see [[ICIT – Experimental Conditions]], [[Frequency Responcse Control]] and [[Plastic Hinge Model]])
*Fracture Toughness (see [[Fracture Mechanics]])
*Fracture Toughness (see [[Fracture Mechanics]])
*[[Fracture Types]]
*[[Fracture Types]]
*Free Energy (see [[Surface Energy]] and [[Rubber Elasticity]])
*[[Free Falling Dart Method]]
*[[Free Falling Dart Method]]
*[[Freezing Time]]
*[[Frequency Analysis]]
*[[Frequency Analysis]]
*[[Frequency Response Control]]
*Friction (see [[Bend Test – Influences]])
*Friction (see [[Bend Test – Influences]])
*[[Friction Force]]
*[[Friction Force]]
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*[[Gas Bubbles]]
*[[Gas Bubbles]]
*[[Geometry Criterion]]
*[[Geometry Criterion]]
*[[Geometry Function]]  
*[[Geometry Function]]
*Glass Fibre Content (see [[Ashing Method]])
*Glass Fibre Content (see [[Ashing Method]])
*[[Glass Fibre Length Distribution – Matrix Resolution]]
*[[Glass Fibre Orientation]]
*[[Glass Fibre Orientation]]
*[[Glass Transition Temperature]]
*[[Glass Transition Temperature]]
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*[[High-speed Tensile Test]]
*[[High-speed Tensile Test]]
*[[HOOKE's Law]]
*[[HOOKE's Law]]
*[[Hole Formation Films]]  
*[[Hole Formation Films]]
*[[Hole Formation Plastics]]
*[[Hole Formation Plastics]]
*HRR Crack Model (see [[Crack Models]])
*HRR Crack Model (see [[Crack Models]])
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*[[Imaging Ultrasonic Testing]]
*[[Imaging Ultrasonic Testing]]
*[[Impact Loading Free-falling Dart Test]]
*[[Impact Loading Free-falling Dart Test]]
*[[Impact Loading High-Speed Testing]]  
*[[Impact Loading High-Speed Testing]]
*[[Impact Loading Pendulum Impact Tester]]
*[[Impact Loading Pendulum Impact Tester]]
*[[Impact Loading Plastics]]
*[[Impact Loading Plastics]]
*[[Impact Test]]  
*[[Impact Test]]
*[[Implant Testing]]
*In-situ Peel Test (see [[Peeling Process]])
*In-situ Peel Test (see [[Peeling Process]])
*[[In-situ Tensile Test in ESEM with AE]]
*[[In-situ Tensile Test in ESEM with AE]]
*[[In-situ Tensile Test in NMR]]  
*[[In-situ Tensile Test in NMR]]
*[[In-situ Ultramicrotomy]]
*[[In-situ Ultramicrotomy]]
*[[Indentation Fracture Mechanics]]
*[[Indentation Fracture Mechanics]]
*[[Indentation Modulus]]  
*[[Indentation Modulus]]
*[[Indenter]]
*[[Indenter]]
*Index of Refraction (see [[Refraction Index]])
*Index of Refraction (see [[Refraction Index]])
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*[[Instrumented Hardness Measurement – Creep]]
*[[Instrumented Hardness Measurement – Creep]]
*[[Instrumented Hardness Measurement – Indentation Depth Measurement with Modified Contact Foot]]
*[[Instrumented Hardness Measurement – Indentation Depth Measurement with Modified Contact Foot]]
*[[Instrumented Hardness Measurement – Relaxation]]  
*[[Instrumented Hardness Measurement – Relaxation]]
*[[Instrumented Hardness Measurement with Tempering]]
*[[Instrumented Hardness Measurement with Tempering]]
*[[Instrumented Hardness Testing – Method & Material Parameters]]
*[[Instrumented Hardness Testing – Method & Material Parameters]]
*[[Instrumented Puncture Impact Test]]
*[[Instrumented Puncture Impact Test]]
*[[Instrumented Scratch Testing]]  
*[[Instrumented Scratch Testing]]
*[[Instrumented Tensile Impact Test (ITIT)]]
*[[Instrumented Tensile Impact Test (ITIT)]]
*[[Instrumented Tensile Impact Test (ITIT), Examples]]
*[[Instrumented Tensile Impact Test (ITIT), Examples]]
*[[Insulation Resistance]]  
*[[Insulation Resistance]]
*Intercalated Structure (see [[Layer Silicate-reinforced Polymers]])
*Intercalated Structure (see [[Layer Silicate-reinforced Polymers]])
*Interface (see [[Phase Boundary Surface]])
*Interface (see [[Phase Boundary Surface]])
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{{Mehrspaltige Liste |breite=30em |liste=
{{Mehrspaltige Liste |breite=30em |liste=
*[[J-Compliance Method]]
*[[J-Compliance Method]]
*[[J-Integral Concept]]  
*[[J-Integral Concept]]
*[[J-Integral Evaluation Methods (Overview)]]
*[[J-Integral Evaluation Methods (Overview)]]
*J-integral Estimation Methods of
*J-Integral Estimation Methods of
::- BEGLEY and LANDES (see [[BEGLEY and LANDES – J-Integral Estimation Method]] (BL))
::- BEGLEY and LANDES (see [[BEGLEY and LANDES – J-Integral Estimation Method]] (BL))
::- RICE, PARIS and MERKLE (see [[RICE, PARIS and MERKLE – J-Integral Estimation Method]] (RPM))
::- RICE, PARIS and MERKLE (see [[RICE, PARIS and MERKLE – J-Integral Estimation Method]] (RPM))
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::- MERKLE and CORTEN (see [[MERKLE and CORTEN – J-Integral Estimation Method]] (MC))
::- MERKLE and CORTEN (see [[MERKLE and CORTEN – J-Integral Estimation Method]] (MC))
::- KANAZAWA (see [[KANAZAWA – J-Integral Estimation Method]] (K))
::- KANAZAWA (see [[KANAZAWA – J-Integral Estimation Method]] (K))
*[[JTJ-Concept]]  
*[[JTJ-Concept]]
}}
}}


== K ==
== K ==
{{Mehrspaltige Liste |breite=30em |liste=
{{Mehrspaltige Liste |breite=30em |liste=
*[[Kausch, Hans-Henning]]  
*[[Kausch, Hans-Henning]]
*KIRCHHOFF's Law of Radiation (see [[Thermography]])
*KIRCHHOFF's Law of Radiation (see [[Thermography]])
*[[KNOOP Hardness]]
*[[KNOOP Hardness]]
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{{Mehrspaltige Liste |breite=30em |liste=
{{Mehrspaltige Liste |breite=30em |liste=
*LAMBERT-BEER's Law (see [[Light Absorption]])
*LAMBERT-BEER's Law (see [[Light Absorption]])
*Lamb Waves (see [[Ultrasonic Plate Waves Sensors]])
*[[Laser Angle-Scanner]]
*[[Laser Angle-Scanner]]
*[[Laser Cross-Unit]]  
*[[Laser Cross-Unit]]
*[[Laser Doppler-Scanner]]
*[[Laser Doppler-Scanner]]
*[[Laser Double-Scanner]]  
*[[Laser Double-Scanner]]
*[[Laser Extensometry]]  
*[[Laser Extensometry]]
*[[Laser Extensometry – Local Strain Control]]
*[[Laser Extensometry – Local Strain Control]]
*[[Laser Heterogeneity of Strain Distribution]]
*[[Laser Heterogeneity of Strain Distribution]]
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*[[Laser Parallel-Scanner]]
*[[Laser Parallel-Scanner]]
*[[Layer Silicate-reinforced Polymers]]
*[[Layer Silicate-reinforced Polymers]]
*[[Laser Sintering Process]]
*[[Laser TMA-Scanner]]
*[[Laser TMA-Scanner]]
*[[Levels of Knowledge in Fracture Mechanics]]
*[[Levels of Knowledge in Fracture Mechanics]]
*[[Lid-opening Test]]
*[[Light Absorption]]
*[[Light Absorption]]
*Light Remission (see [[Remission Light]])
*Light Transmission (see [[Transmission Light]])
*Linear-elastic Fracture Mechanics (LEFM) (see [[Fracture Mechanics]])
*Linear-elastic Fracture Mechanics (LEFM) (see [[Fracture Mechanics]])
*[[Linear-viscoelastic Behaviour]]
*[[Linear-viscoelastic Behaviour]]
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*[[Machine Compliance]]
*[[Machine Compliance]]
*[[Macrodispersion Degree Elastomers]]
*[[Macrodispersion Degree Elastomers]]
*[[Magnification Microscope]]
*[[Manufacturer of Material Testing Machines]]
*[[Manufacturer of Material Testing Machines]]
*[[Martens, Adolf]]
*[[Martens, Adolf]]
*[[Material Parameter]]
*[[Materialography]]
*[[Material Science & Plastics]]
*[[Material Science & Plastics]]
*[[Materials Science]]
*[[Materials Science]]
*[[Material Parameter]]
*[[Materials Technology & Materials Science]]
*[[Materials Technology & Materials Science]]
*[[Material Testing Machine]]
*[[Material Testing Machine]]
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*[[MAXWELL Model]]
*[[MAXWELL Model]]
*[[Measure]]
*[[Measure]]
*[[Measure Deviation]]
*[[Measured Value]]
*[[Measured Value]]
*[[Measured Value Accuracy]]
*[[Measured Value Accuracy]]
*[[Measured Variable]]
*[[Measured Variable]]
*[[Measurement Deviation]]
*[[Measuring Accuracy]]
*[[Measuring Accuracy]]
*[[Measuring Device Monitoring]]
*[[Measuring Device Monitoring]]
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*Melt Flow Index (see [[Melt Mass-Flow Rate]] and [[Melt Volume-Flow Rate]])
*Melt Flow Index (see [[Melt Mass-Flow Rate]] and [[Melt Volume-Flow Rate]])
*[[Melt Mass-Flow Rate]]
*[[Melt Mass-Flow Rate]]
*Melt Temperatur (see [[Differential Scanning Calorimetry (DSC)]] and [[Crystallinity]])
*[[Melt Volume-Flow Rate]]
*[[Melt Volume-Flow Rate]]
*[[Menges, Georg]]
*[[Menges, Georg]]
*[[MERKLE and CORTEN – J-Integral Estimation Method]]
*[[MERKLE and CORTEN – J-Integral Estimation Method]]
*[[Metallography]]
*MFR (see [[Melt Mass-Flow Rate]])
*MFR (see [[Melt Mass-Flow Rate]])
*[[Michler, Goerg Hannes]]
*[[Michler, Goerg Hannes]]
*Microcrack (see [[Crack]])
*Microcrack (see [[Crack]])
*[[Micro-Damage Limit]]
*[[Micro-Damage Limit]]
*Mcrohardness (see [[Hardness]])
*Microhardness (see [[Hardness]])
*Micro-IRHD (see [[IRHD Hardness]])
*Micro-IRHD (see [[IRHD Hardness]])
*[[Micromechanics & Nanomechanics]]
*[[Micromechanics & Nanomechanics]]
*[[Microplastic & Nanoplastic]]
*[[Micropores]]
*[[Micropores]]
*[[Microscopic Structure]]
*[[Microscopic Structure]]
*[[Micro-Tensile Tests]]
*[[Microtomy]]
*[[Microtomy]]
*[[Mixed-Mode Crack Propagation]]
*[[Mixed-Mode Crack Propagation]]
*[[MMB-Specimen]]
*[[MMB-Specimen]]
*[[Mobile Hardness Measurement]]
*[[Mobile Hardness Measurement]]
*Modulus of Compressibility (see [[Energy Elasticity]])
* Modulus of Elasticity (see [[Elastic Modulus]])
*[[Mohs, Carl Friedrich Christian]]
*Morphology (see [[Microscopic Structure]])
*Morphology (see [[Microscopic Structure]])
*Moulded Part (see [[Moulding Compound]])
*Moulded Part (see [[Moulding Compound]])
*[[Moulding Compound]]
*[[Moulding Compound]]
*Modulus of Compressibility (see [[Energy Elasticity]])
* Modulus of Elasticity (see [[Elastic Modulus]])
*[[Mohs, Carl Friedrich Christian]]
*[[Moulding Compound Test]]
*[[Moulding Compound Test]]
*[[MPK-Procedure MPK-ICIT]]
*[[MPK-Procedure MPK-ICIT]]
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{{Mehrspaltige Liste |breite=30em |liste=
{{Mehrspaltige Liste |breite=30em |liste=
*Nanocomposite (see [[Layer Silicate-reinforced Thermoplastics]])
*Nanocomposite (see [[Layer Silicate-reinforced Thermoplastics]])
*[[Nanoindentation Testing]]
*[[Nase, Michael]]
*Necking Elongation (see [[Tensile Test Uniform Elongation]])
*Necking Elongation (see [[Tensile Test Uniform Elongation]])
*[[Non-destructive Polymer Testing]]
*[[Non-destructive Polymer Testing]]
Line 485: Line 530:
*Normative Strain (see [[Tensile Strength]])
*Normative Strain (see [[Tensile Strength]])
*[[Notch]]
*[[Notch]]
*[[Notched Impact Test]]
*[[Notched Tensile Impact Test]]
*[[Notch Geometry]]
*[[Notch Geometry]]
*Notch Impact Strength (see [[Notched Impact Test]])
*Notch Impact Strength (see [[Notched Impact Test]])
*Notch Insertion (see [[Notching]])
*Notch Insertion (see [[Notching]])
*[[Notch Sensitivity]]
*[[Notched Impact Test]]
*[[Notched Tensile Impact Test]]
*[[Notching]]
*[[Notching]]
*[[Notch Sensitivity]]
*[[Nuclear Magnetic Resonance Spectroscopy]] (NMR Spectroscopy)
*[[Nuclear Magnetic Resonance Spectroscopy]] (NMR Spectroscopy)
}}
}}
Line 497: Line 542:
== O ==
== O ==
{{Mehrspaltige Liste |breite=30em |liste=
{{Mehrspaltige Liste |breite=30em |liste=
*[[Object Raster Method]]
*Orientation (see [[Tensile Test Residual Stresses Orientations]])
*Orientation (see [[Tensile Test Residual Stresses Orientations]])
*Overview about J-Integral Evaluation Methods (see [[J-Integral Evaluation Methods (Overview)]])
*Overview about J-Integral Evaluation Methods (see [[J-Integral Evaluation Methods (Overview)]])
*[[ODCB or MC-DCB-Specimen]]
}}
}}


Line 510: Line 557:
*[[Peel-Cling Test]]
*[[Peel-Cling Test]]
*[[Peel-Cling Test Cyclic]]
*[[Peel-Cling Test Cyclic]]
*[[Peel-Cring Test Extented]]
*[[Peel-Cling Test Extented]]
*Peel Curve (see [[Peel Force – Fracture Path Diagram]])
*[[Peel Force]]
*[[Peel Force]]
*[[Peel Force – Fracture Path Diagram]]
*[[Peel Force – Fracture Path Diagram]]
Line 519: Line 567:
*[[Pennsylvania Edge Notch Tensile (PENT) Test]]
*[[Pennsylvania Edge Notch Tensile (PENT) Test]]
*[[Peripheral Fibre Strain]]
*[[Peripheral Fibre Strain]]
*[[Permeation]]
*[[Phase Boundary Surface]]
*[[Phase Boundary Surface]]
*[[Piezoelectric Ceramic]]
*[[Piezoelectric Ceramic]]
Line 524: Line 573:
*Piezoelectric Effect (see [[Piezoelectric Force Transducer]] and [[Piezo Ceramics]])
*Piezoelectric Effect (see [[Piezoelectric Force Transducer]] and [[Piezo Ceramics]])
*[[Piezoelectric Force Transducer]]
*[[Piezoelectric Force Transducer]]
*PLANCK's constant (see [[Resolution Microscope]])
*[[Plane Stress and Strain State]]
*[[Plane Stress and Strain State]]
*Plastic Deformation (see [[Deformation]])
*[[Plastic Component]]
*[[Plastic Films & Varnishes – Surface Technology]]
*[[Plastic Films & Varnishes – Surface Technology]]
*[[Plastic Component]]
*Plastic Deformation (see [[Deformation]])
*Plastic Deformation (see [[Deformation]])
*[[Plastic Hinge Model]]
*[[Plastics]]
*[[Plastics]]
*[[Plastics – Symbols and Abbreviated Terms]]
*[[Plastics – Symbols and Abbreviated Terms]]
Line 541: Line 591:
*[[Polymers & Structure]]
*[[Polymers & Structure]]
*[[Polymer Testing]]
*[[Polymer Testing]]
*[[Pourability]]
*[[Processing Shrinkage]]
*[[Processing Shrinkage]]
*[[Producer Material Testing Machines]] (see: [[Manufacturer Material Testing Machines]])
*Producer Material Testing Machines (see [[Manufacturer Material Testing Machines]])
*Proof Tracking Index (CTI) (see [[Creep Current Resistance]])
*Proof Tracking Index (CTI) (see [[Creep Current Resistance]])
*[[Prosthesis Pull-through Test]]
*[[Pulse-Echo Ultrasonic Technique]]
*[[Pulse-Echo Ultrasonic Technique]]
*[[Puncture Impact Test]]
*[[Puncture Impact Test]]
*[[Pure Shear-Specimen]]
*[[Pure Shear-Specimen]]
*[[Push-Out Test]]
}}
}}


Line 558: Line 611:
{{Mehrspaltige Liste |breite=30em |liste=
{{Mehrspaltige Liste |breite=30em |liste=
*[[Radusch, Hans-Joachim]]
*[[Radusch, Hans-Joachim]]
*[[Ramps, Clods and Steps]]
*[[Raster Reflection Method]]
*R-Curve Concept (see [[Crack Resistance (R) Curve]])
*[[Ramps, Bars and Steps]]
*[[Rebound Resilience Elastomers]]
*[[Rebound Resilience Elastomers]]
*[[Reflection Light]]
*[[Reflection Light]]
*[[Reflection Sound Waves]]
*Reflection Sound Waves (see [[Ultrasonic Waves Reflection]])
*[[Refraction Index]]
*[[Refraction Index]]
*Refraction Law (see [[Refraction Light]] and [[Refraction Sound Waves]])
*Refraction Law (see [[Refraction Light]] and [[Refraction Sound Waves]])
Line 568: Line 623:
*Refractive Index (see [[Refraction Index]])
*Refractive Index (see [[Refraction Index]])
*[[Reincke, Katrin]]
*[[Reincke, Katrin]]
*Relation Factor (see [[Plastic Hinge Model]])
*[[Relaxation Behaviour Determination]]
*[[Relaxation Behaviour Determination]]
*[[Relaxation Plastics]]
*[[Relaxation Plastics]]
*[[Remission Light]]
*[[Repose Angle]]
*Residual Compressive Strength (see [[Compression After Impact Test]])
*Residual Stress ( see [[Tensile Test Residual Stresses Orientations]])
*Residual Stress ( see [[Tensile Test Residual Stresses Orientations]])
*[[Resolution Laser Extensometer Device System]]
*[[Resolution Material Testing Machine]]
*[[Resolution Material Testing Machine]]
*[[Resolution Microscope]]
*[[Resolution Microscope]]
Line 576: Line 636:
*[[RICE, PARIS and MERKLE – J-Integral Estimation Method]]
*[[RICE, PARIS and MERKLE – J-Integral Estimation Method]]
*Rise Time Electronic Measuring Chain (see [[ICIT – Experimental Conditions]])
*Rise Time Electronic Measuring Chain (see [[ICIT – Experimental Conditions]])
*[[Rheometry]]
*[[ROCKWELL Hardness]]
*[[ROCKWELL Hardness]]
*[[Roll Ring Test]]
*[[Rotational Rheometer]]
*[[Round Specimen]]
*[[Round Specimen]]
*[[Round Robin Test]]
*[[Round Robin Test]]
*[[Rubber Elasticity]]
}}
}}


Line 585: Line 649:
*[[Scanning Acoustic Microscopy (SAM)]]
*[[Scanning Acoustic Microscopy (SAM)]]
*[[Scanning Electron Microscopy]] (SEM)
*[[Scanning Electron Microscopy]] (SEM)
*[[SCB-Specimen]]
*[[Scratch Hardness]]
*[[Scratch Hardness]]
*[[Scratch Resistance]]
*[[Scratch Resistance]]
*[[Sealed Beam]]
*[[Scratch Test]]
*[[Sealed Seam]]
*Secant Modulus (see [[Flexural Modulus]], [[Elastic Modulus]] and [[Compression Test]])
*Secant Modulus (see [[Flexural Modulus]], [[Elastic Modulus]] and [[Compression Test]])
*[[Seidler, Sabine]]
*[[Seidler, Sabine]]
Line 603: Line 669:
*Short-beam Bend Test (see [[Interlaminar Shear Strength]])
*Short-beam Bend Test (see [[Interlaminar Shear Strength]])
*[[Short-fibre Reinforced Plastics]]
*[[Short-fibre Reinforced Plastics]]
*Shunt Lid Pull-trough Test (see [[Prosthesis Pull-trough Test]])
*[[Shrink Voids]]
*[[Shrink Voids]]
*Shrinkage (see [[Processing Shrinkage]])
*[[Shrinkage]]
*[[Shrinkage Test]]
*[[Shrinkage Test]]
*Simple Beam Theory (SBT) (see [[Adhesive Joints – Determination of Characteristic Values]])
*Simple Beam Theory (SBT) (see [[Adhesive Joints – Determination of Characteristic Values]])
Line 612: Line 679:
*[[Smart Materials]]
*[[Smart Materials]]
*SNEDDON-Williams-Equations (see [[Crack Model according to GRIFFITH]])
*SNEDDON-Williams-Equations (see [[Crack Model according to GRIFFITH]])
*SNELLIUS' Law of Refraction (see [[Ultrasonic Birefringence]], [[Ultrasonic Angle Beam Sensors]] and [[Refraction Light]])
*Sonography (see [[Ultrasound Testing]])
*Sonography (see [[Ultrasound Testing]])
*Sound Absorption Coefficient (see [[Elastic Modulus]])
*Sound Absorption Coefficient (see [[Elastic Modulus]])
Line 626: Line 694:
*[[Specimen Compliance]]
*[[Specimen Compliance]]
*[[Specimen for Fracture Mechanics Tests]]
*[[Specimen for Fracture Mechanics Tests]]
*Specimen Shapes For Fatigue Tests (see [[Test Specimen for Fatigue Tests]])
*[[Specimen for Laser Sintering]]
*Specimen Shapes for Fatigue Tests (see [[Test Specimen for Fatigue Tests]])
*Speed (see [[Velocity]])
*Speed (see [[Velocity]])
*[[Spherulitic Structure]]
*[[Spherulitic Structure]]
*SPLIT-HOPKINSON Pressure Bar (SHPB) Test (see [[Strain Rate Applications]])
*[[Squirter Technique]]
*[[Squirter Technique]]
*Stability Time (see [[Thermostability PVC]])
*Stability Time (see [[Thermostability PVC]])
Line 653: Line 723:
*[[Surface Energy]]
*[[Surface Energy]]
*[[Surface Resistance]]
*[[Surface Resistance]]
*[[Surface Technology]]
*[[Surface Tension and Interfacial Tension]]
*[[Surface Tension and Interfacial Tension]]
*[[Surface Testing Technology]]
*[[Surface Testing Technology]]
Line 663: Line 734:
*Tangent Modulus (see [[Elastic Modulus]] and [[Shear Modulus]])
*Tangent Modulus (see [[Elastic Modulus]] and [[Shear Modulus]])
*[[T-Peel Test]]
*[[T-Peel Test]]
*[[TDCB-Specimen]] (Tapered-Double-Cantilever Beam-specimen)
*[[Tear Test]]
*[[Tear Test]]
*Tearing Energy (see [[Trouser Specimen]])
*Tearing Energy (see [[Trouser Specimen]])
*[[Tearing Modulus]]
*[[Temperature Conductivity]]
*[[Temperature Conductivity]]
*[[Temperature-modulated Differential Scanning Calorimetry (TMDSC)]]
*[[Temperature-modulated Differential Scanning Calorimetry (TMDSC)]]
Line 684: Line 757:
*[[Test Climate]]
*[[Test Climate]]
*[[Testing]]
*[[Testing]]
*Testing of Adhesive Bonds (see [[SCB-Specimen]])
*Testing of Composite Materials (see [[Composite Materials Testing]])
*Testing of Composite Materials (see [[Composite Materials Testing]])
*[[Testing Microcomponents]]
*[[Testing Microcomponents]]
Line 691: Line 765:
*[[Test Specimen for Fatigue Tests]]
*[[Test Specimen for Fatigue Tests]]
*[[Test Speed]]
*[[Test Speed]]
*[[TDCB-Specimen]] (Tapered-Double-Cantilever Beam-specimen)
*[[Thermal Conductivity]]
*[[Thermal Conductivity]]
*Thermal Diffusivity (see [[Temperature Conductivity]])
*Thermal Diffusivity (see [[Temperature Conductivity]])
Line 700: Line 773:
*[[Thermography]]
*[[Thermography]]
*[[Thermogravimetric Analysis (TGA)]]
*[[Thermogravimetric Analysis (TGA)]]
*[[Thermomechanical Analysis (TMA)]]
*[[Thermomechanical Analysis]] (TMA)
*[[Thermoplastic Material]]
*[[Thermoplastic Material]]
*[[Thermosets]]
*[[Thermosets]]
Line 709: Line 782:
*[[Time–Temperature Shift Law]]
*[[Time–Temperature Shift Law]]
*Titration Method (see [[Density]])
*Titration Method (see [[Density]])
*TODCB-Specimen (see [[SCB-Specimen]])
*[[Toughness]]
*[[Toughness]]
*[[Toughness Temperature Dependence]]
*[[Toughness Temperature Dependence]]
Line 724: Line 798:
==U==
==U==
{{Mehrspaltige Liste |breite=30em |liste=
{{Mehrspaltige Liste |breite=30em |liste=
*UD Tape (see [[Composite Materials Testing]] and [[Multiple Fracture UD Tapes]])
*[[Ultramicrotomy]]
*[[Ultrasonic Angle Beam Sensors]]
*[[Ultrasonic Angle Beam Sensors]]
*[[Ultrasonic Birefringence]]
*[[Ultrasonic Birefringence]]
*[[Ultrasonic Compact Impedance (UCI) Hardness]]
*[[Ultrasonic Contact Impedance (UCI) Hardness]]
*[[Ultrasonic Composite Sensors]]
*[[Ultrasonic Composite Sensors]]
*[[Ultrasonic Direct Coupling]]
*[[Ultrasonic Direct Coupling]]
*Ultrasonic Imaging Inspection (see [[Imaging Ultrasonic Testing]])
*Ultrasonic Imaging Inspection (see [[Imaging Ultrasonic Testing]])
*[[Ultrasonic Laser Excitation]]
*[[Ultrasonic Immersion Bath Technique]]
*[[Ultrasonic Immersion Bath Technique]]
*[[Ultrasonic Immersion Bath Sensors]]
*[[Ultrasonic Immersion Bath Sensors]]
*[[Ultrasonic Laser Excitation]]
*Ultrasonic Microscopy (see [[Scanning Acoustic Microscopy (SAM)]])
*Ultrasonic Microscopy (see [[Scanning Acoustic Microscopy (SAM)]])
*[[Ultrasonic Modulation]]
*[[Ultrasonic Modulation]]
*[[Ultrasonic Phased Array Sensors]]
*[[Ultrasonic Phased Array Sensors]]
*[[Ultrasonic Plate Waves Sensors]]
*Ultrasonic Pulse-echo Technique (see [[Pulse-Echo Ultrasonic Technique]])
*Ultrasonic Pulse-echo Technique (see [[Pulse-Echo Ultrasonic Technique]])
*[[Ultrasonic Runtime Measurement]]
*[[Ultrasonic Runtime Measurement]]
Line 748: Line 825:
*[[Ultrasonic Weld Inspection]]
*[[Ultrasonic Weld Inspection]]
*[[Ultrasound – Elastic Parameters]]
*[[Ultrasound – Elastic Parameters]]
*[[Ultrasound-guided Waves]]
*[[Ultrasound Testing]]
*[[Ultrasound Testing]]
*[[Uniaxial Stress State]]
*[[Uniaxial Stress State]]
Line 753: Line 831:
*[[Universal Hardness]]
*[[Universal Hardness]]
*Universal Testing Machine (see [[Material Testing Machine]])
*Universal Testing Machine (see [[Material Testing Machine]])
*UODCB-Specimen (see [[SCB-Specimen]])
}}
}}


Line 759: Line 838:
*Vacuoles (see [[Shrink Voids]])
*Vacuoles (see [[Shrink Voids]])
*Value (see [[Material Value]])
*Value (see [[Material Value]])
*Valve Control Test (see [[Lid-opening Test]])
*[[Valve Movement Test]]
*[[Valve Movement Test]]
*[[Velocity]]
*[[Velocity]]
Line 773: Line 853:
*Viscous Deformation (see [[Deformation]])
*Viscous Deformation (see [[Deformation]])
*[[Viscosity]]
*[[Viscosity]]
*[[Visual Inspection]]
*[[VOIGT-KELVIN Model]]
*[[Volume Resistance]]
*[[Volume Resistance]]
*[[Volume Swelling Elastomers]]
*[[Volume Swelling Elastomers]]
Line 782: Line 864:
{{Mehrspaltige Liste |breite=30em |liste=
{{Mehrspaltige Liste |breite=30em |liste=
*[[Water Absorption]]
*[[Water Absorption]]
*Wavelet Transform (see [[Frequency Analysis]])
*[[Waves and Arrest Lines]]
*[[Waves and Arrest Lines]]
*Wear (see [[Abrasion Elastomers]])
*Wear (see [[Abrasion Elastomers]])
*[[Williams, James Gordon]]
*[[WinICIT-Software]]
*[[WinICIT-Software]]
*Wheatstone Bridge (see [[Strain Gauge]])
*[[Weld Line]]
*[[Weld Line]]
* WU & FOWKES method (see [[Surface Tension and Interfacial Tension]])
* WU & FOWKES method (see [[Surface Tension and Interfacial Tension]])
* WHEATSTONE's Bridge Circuit (see [[Strain Gauge]], [[Electro-mechanical Force Transducer]], and [[ICIT with AE]])
}}
}}


Line 811: Line 895:
*[[:Category:Creep Behaviour Plastics|Creep Behaviour Plastics]]
*[[:Category:Creep Behaviour Plastics|Creep Behaviour Plastics]]
*[[:Category:Damage Analysis_Component Failure|Damage Analysis/Component Failure]]
*[[:Category:Damage Analysis_Component Failure|Damage Analysis/Component Failure]]
*[[:Category:Deformation engl|Deformation]]
*[[:Category:Deformation|Deformation]]
*[[:Category:Elastomers|Elastomers]]
*[[:Category:Elastomers|Elastomers]]
*[[:Category:Electrical and Dielectrical Testing|Electrical and Dielectrical Testing]]
*[[:Category:Electrical and Dielectrical Testing|Electrical and Dielectrical Testing]]

Latest revision as of 14:03, 3 September 2026

Welcome to the PSM Wiki-lexicon "Polymer Testing & Diagnostics" from Polymer Service GmbH Merseburg (PSM)!

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